|
项目/Item
|
物性/Property
|
单位/Unit
|
ZKPI-3000
|
测试条件
|
|
|
应用/Application
|
|
半导体器件保护、光纤保护
|
300±20℃
|
|
液体性质
Liquid Property |
固含量/Solid Content
|
wt.%
|
15±5 %
|
|
|
黏度/Viscosity
|
mPa•s/CP
|
1000-7000cp
|
E-type 25℃
|
|
|
离子含量/Impurity Content
|
ppm
|
<2
|
ICP-MS
|
|
|
色度(Gardner)/Coloring
|
|
<12
|
Gardner
|
|
|
膜性质
Film Property |
拉伸强度/Ultimate tensile strength
|
MPa
|
> 100
|
|
|
拉伸模量/Tensile modulus
|
GPa
|
> 3.0
|
|
|
|
断裂伸长率/Elongation at break
|
%
|
> 10
|
|
|
|
Tg
|
℃（DSC）
|
> 280
|
|
|
|
热分解温度/Thermal decomposition temperature
|
℃（TGA）
|
> 500
|
|
|
|
热膨胀系数/Coefficient of thermal expansion
|
ppm/℃（TMA）
|
< 35
|
|
|
|
内应力/Internal stress
|
MPa
|
<34
|
|
|
|
介电常数/Dielectric constant
|
1 MHz
|
< 3.2
|
|
|
|
介电损耗/Dielectric loss
|
1 MHz
|
< 0.008
|
|
|
|
介电强度/Dielectric strength
|
V/mm
|
> 250
|
|
|
|
体积电阻率/Volume resistivity
|
W.cm2
|
> 1 x 1016
|
|
|
|
表面电阻率/Surface resistivity
|
W.cm
|
>1 x 1016
|
|
|
|
吸水率/Water absorption
|
%
|
< 0.6
|
|
|
|
产品特点
|
耐高温、粘附性、柔顺性
|
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